Effect of Er:YAG laser enamel conditioning and moisture on the microleakage of a hydrophilic sealant


Creative Commons License

Guclu Z. A. , Hurt A. P. , Donmez N. , Coleman N. J.

ODONTOLOGY, cilt.106, ss.225-231, 2018 (SCI İndekslerine Giren Dergi) identifier identifier identifier

  • Cilt numarası: 106 Konu: 3
  • Basım Tarihi: 2018
  • Doi Numarası: 10.1007/s10266-017-0323-4
  • Dergi Adı: ODONTOLOGY
  • Sayfa Sayısı: ss.225-231

Özet

For a given sealant, successful pit and fissure sealing is principally governed by the enamel conditioning technique and the presence of moisture contamination. A new generation of hydrophilic resin sealants is reported to tolerate moisture. This study investigates the impact of Er:YAG laser pre-conditioning and moisture contamination on the microleakage of a recent hydrophilic sealant. Occlusal surfaces of extracted human molars were either acid etched (n = 30), or successively lased and acid etched (n = 30). Ten teeth from each group were either air-dried, water-contaminated, or saliva-contaminated prior to sealing with UltraSeal XTA (R) hydro (TM). Samples were inspected for penetration of fuchsin dye following 3000 thermocycles between 5 and 50 A degrees C, and the enamel-sealant interfaces were observed by scanning electron microscopy (SEM). Significant differences in microleakage were evaluated using the Mann-Whitney U test with Bonferroni adjustment (p = 0.05). Laser pre-conditioning significantly reduced dye penetration irrespective of whether the enamel surface was moist or dry. Microleakage of water-contaminated acid etched teeth was significantly greater than that of their air-dried or saliva-contaminated counterparts. SEM analysis demonstrated good adaptation in all groups with the exception of water-contaminated acid etched teeth which exhibited relatively wide gaps. In conclusion, this hydrophilic sealant tolerates the presence of saliva, although water was found to impair its sealing ability. Laser pre-conditioning significantly decreases microleakage in all cases.